{"id":16629,"date":"2024-05-01T20:55:15","date_gmt":"2024-05-01T12:55:15","guid":{"rendered":"https:\/\/cde.nus.edu.sg\/mse\/?page_id=16629"},"modified":"2024-09-18T17:59:34","modified_gmt":"2024-09-18T09:59:34","slug":"t11-devices","status":"publish","type":"page","link":"https:\/\/cde.nus.edu.sg\/mse\/t11-devices\/","title":{"rendered":"T11 Devices"},"content":{"rendered":"\n<h1>\n\t\tDevices\n\t<\/h1>\n\t<p><strong>Providing a wide range of support for various interdisciplinary research, the Litho Lab &amp; Cleanroom facilities are equipped for UV lithography, thin film coating, reactive ion etching etc.\u00a0<\/strong><\/p>\n<p><strong>Thin Film Deposition Facilities<\/strong><\/p>\n<p>The Litho Lab consists of a clean room fully equipped for UV lithography and other processes (e.g. thin film deposition, RIE\/ICP dry etching, etc.):<\/p>\n<ul>\n<li><strong>Lithography<\/strong>\u00a0includes laser writing system for mask making and direct writing, and a conventional mask aligner for pattern transfer.<\/li>\n<li><strong>Thin film deposition<\/strong>\u00a0includes thermal evaporation (Cu, Au, etc.) and e-beam evaporation (Cr, Ti, Al, etc.)<\/li>\n<li><strong>Dry etching<\/strong> includes RIE\/ICP etching equipment for dry etching of Si, oxide compound and other materials with process gases Ar, CF<sub>4<\/sub>, C<sub>4<\/sub>F<sub>8<\/sub>, CHF<sub>3<\/sub>, He, N<sub>2<\/sub>, O<sub>2<\/sub>, SF<sub>6<\/sub>.<\/li>\n<\/ul>\n<section data-id=\"4490406\" data-element_type=\"section\" data-settings=\"{&quot;stretch_section&quot;:&quot;section-stretched&quot;}\"><\/section>\n<section data-id=\"a0adb6b\" data-element_type=\"section\" data-settings=\"{&quot;stretch_section&quot;:&quot;section-stretched&quot;}\">\n<p><strong>The Litho Lab<\/strong><\/p>\n<p>Providing support for the various and interdisciplinary research, such as Multifunctional (oxide) materials; Ferroelectric tunnelling junction; Superconductor-insulator transitions; Ambipolar superconductivity; Hall effect measurements; Spin pumping; Electric control of magnetism; Plasmonic transducer; Fe2O3-H-doping; Graphene nanochannels; Hybrid integrated flexible electronic, Metamaterials, etc.<\/p>\n<p>Clean room facilities have following facilities to support the various and interdisciplinary research such as a class 10K cleanroom with the following equipment.<\/p>\n<ul>\n<li>Heidelberg DWL66 laser writer for mask writing and direct writing capabilities;<\/li>\n<li>MJB4 SUSS Mask aligner;<\/li>\n<li>CEE Spin coater;<\/li>\n<li>Hot plates;<\/li>\n<li>AJA e-gun and thermal evaporator;<\/li>\n<li>Sentech SI 500 ICP etcher<\/li>\n<li>Bruker Dektat Contact Profiler;<\/li>\n<li>Optical microscope (Olympus);<\/li>\n<\/ul>\n<\/section>\n\t\t\t\t\t\t<h5>How to Access Facilities<\/h5>\n\t\t\t<p>To access the facility, the following steps must be followed: <\/p>\n<p>Contact Ngee Hong Teo (mtnh@nus.edu.sg) and Tiho (tiho@nus.edu.sg) to schedule a project meeting.<\/p>\n<p>Register your personal and project details with PPMS (<a href=\"https:\/\/ppms.asia\/nus-cde\/login\/\">https:\/\/ppms.asia\/nus-cde\/login\/<\/a>)<\/p>\n<p>Schedule a training or service session with our staff.<\/p>\n\t\t\t\t\t\t<h5>Service &amp; Booking Fees<\/h5>\n\t\t\t<p>Booking fees will differ for NUS and Non-NUS members. More details will be published soon.\u00a0<\/p>\n\t\t\t\t\t\t<h5>Our Partners<\/h5>\n\t\t\t<p>Find out more about our partners in Singapore:<\/p>\n<p><a href=\"https:\/\/cde.nus.edu.sg\/emf\">Electron Microscopy Facility (EMF)<\/a><\/p>\n<p><a href=\"https:\/\/www.singascope.sg\/\">SingaScope<\/a><\/p>\n<p><a href=\"https:\/\/www.dbs.nus.edu.sg\/cbis\/\">NUS Center for Bioimaging Sciences (CBIS)<\/a><\/p>\n<p><a href=\"https:\/\/medicine.nus.edu.sg\/core-facilities\/electron-microscopy-unit-emu\/\">NUS YLL School of Medicine Electron Microscopy Unit (EMU)<\/a><\/p>\n<p><a href=\"https:\/\/www.ntu.edu.sg\/facts\">NTU Facility for Analysis, Characterization, Testing and Simulation (FACTS)<\/a><\/p>\n<p><a href=\"https:\/\/www.a-star.edu.sg\/imre\/research-departments\/advanced-characterization-and-instrumentation\">A*STAR IMRE Advanced Characterization and Instrumentation (ACI) Department<\/a><\/p>\n\t<h1>Contact Us<\/h1>\n\t<strong>Research Fellow : <\/strong>Tiho@nus.edu.sg<br \/>\n<strong>Lab Technologist : <\/strong>Mtnh@nus.edu.sg<br \/>\n<strong>Communications : <\/strong>Samuel@nus.edu.sg\nT11 Shared Facilities<br \/>\nLevel 11<br \/>\nT-Lab Building<br \/>\n5A Engineering Drive 1<br \/>\nCollege of Design and Engineering<br \/>\nSingapore 117411\n\t\n<h1>\n\t\tFACILITIES\n\t<\/h1>\n\t<h3>Click on the icon\/tab to learn more about our facilities at NUS T11:<\/h3>\n\t<ul data-height=\"150\" data-width=\"150\" data-shape=\"square\">\n\t\t\t\t\t\t\t\t\t\t<li>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<a target=\"_blank\" rel=\"noopener\" href=\"https:\/\/cde.nus.edu.sg\/mse\/t11-material-synthesis\">\n\t\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" src=\"https:\/\/cde.nus.edu.sg\/mse\/wp-content\/uploads\/sites\/4\/2024\/04\/icon_01.png\" alt=\"\" \/>\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<\/ul>\n\t<ul data-height=\"150\" data-width=\"150\" data-shape=\"square\">\n\t\t\t\t\t\t\t\t\t\t<li>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<a target=\"_blank\" rel=\"noopener\" href=\"https:\/\/cde.nus.edu.sg\/mse\/t11-structural-characterisation\">\n\t\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" src=\"https:\/\/cde.nus.edu.sg\/mse\/wp-content\/uploads\/sites\/4\/2024\/04\/icon_02.png\" alt=\"\" \/>\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<\/ul>\n\t<ul data-height=\"150\" data-width=\"150\" data-shape=\"square\">\n\t\t\t\t\t\t\t\t\t\t<li>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<a target=\"_blank\" rel=\"noopener\" href=\"https:\/\/cde.nus.edu.sg\/mse\/t11-properties\">\n\t\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" src=\"https:\/\/cde.nus.edu.sg\/mse\/wp-content\/uploads\/sites\/4\/2024\/04\/icon_03.png\" alt=\"\" \/>\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<\/ul>\n\t<ul data-height=\"150\" data-width=\"150\" data-shape=\"square\">\n\t\t\t\t\t\t\t\t\t\t<li>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<a target=\"_blank\" rel=\"noopener\" href=\"https:\/\/cde.nus.edu.sg\/mse\/t11-devices\">\n\t\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" src=\"https:\/\/cde.nus.edu.sg\/mse\/wp-content\/uploads\/sites\/4\/2024\/04\/icon_04.png\" alt=\"\" \/>\t\t\t\t\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/a>\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/li>\n\t\t\t\t\t\t\t\t\t\t\t\t\t<\/ul>\n<h1>\n\t\tMaterial synthesis\n\t<\/h1>\n<h2>\n\t\tStructural Characterisation\n\t<\/h2>\n<h2>\n\t\tProperties\n\t<\/h2>\n<h2>\n\t\tDevices\n\t<\/h2>\n<h3>\n\t\tLithography\n\t<\/h3>\n\t\t\t\t<img loading=\"lazy\" decoding=\"async\" src=\"https:\/\/cde.nus.edu.sg\/mse\/wp-content\/uploads\/sites\/4\/2024\/05\/mask-1.jpg\" alt=\"mask\" height=\"337\" width=\"388\" title=\"mask\" \/>\n\t<h2>Mask aligner: SUSS Microtec- MJB4<\/h2>\nThe mask aligner is a faster way to write the pattern using pre-written mask. It operates in either contact or proximity mode.\n<hr \/>\n<strong>Technical Specifications:<\/strong>\nMinimum substrate size: 5&#215;5 mm2<br \/>\nMask size: 6&#8243;x6&#8243;<br \/>\nSource: DC lamp (405 nm)<br \/>\nSource power: 70 mW<br \/>\nResolution: 3 um\n<p><b>Location: T-Lab, level 11, Clean Room and Litho-Lab<\/b><\/p>\n\t\t\t\t<img loading=\"lazy\" decoding=\"async\" src=\"https:\/\/cde.nus.edu.sg\/mse\/wp-content\/uploads\/sites\/4\/2024\/05\/surface-300x209-1.jpg\" alt=\"surface-300x209\" height=\"209\" width=\"300\" title=\"surface-300x209\" \/>\n\t<h3>Surface Stylus Profiler: Bruker DektakXT<\/h3>\nThe profiler is a fast and easy-to-use counterpart of atomic force microscope. It is very reliable for measuring step height of 50nm to &gt;1um.\n<strong>Technical Specifications<\/strong>\n<ul>\n<li>X and Y Stage: 2\u00b5m repeatability.<\/li>\n<li>Z Stage: Soft touch stylus null.<\/li>\n<li>Fast data collection and analysis.<\/li>\n<\/ul>\n<p><b>Location: T-Lab, level 11, Litho Lab<\/b><\/p>\n\t<h3>Spin Coater: Cee\u00ae 200X\u00a0<\/h3>\nFully programmable and user-friendly, the Cee\u00ae 200X features the accuracy and repeatability needed to eliminate processing variability from photoresist and thin film deposition processes\n<strong>Technical Specifications<\/strong>\n<ul>\n<li>Minimum substrate size: 3&#215;3 mm2<\/li>\n<li>Maximum substrate size: 8&#8243;x8&#8243;<\/li>\n<li>Maximum Speed: 6000 RPM<\/li>\n<li>Available resists: AZ5214E, AZ9264 &amp; SU-8 resist<\/li>\n<\/ul>\n<p>&nbsp;<\/p>\n\t\t\t\t<img loading=\"lazy\" decoding=\"async\" src=\"https:\/\/cde.nus.edu.sg\/mse\/wp-content\/uploads\/sites\/4\/2024\/05\/inductivity-device-300x274-1.png\" alt=\"inductivity-device-300x274\" height=\"274\" width=\"300\" title=\"inductivity-device-300x274\" \/>\n\t<h3>Inductively coupled Plasma Etch system: Sentech-SI500\u00a0<\/h3>\nThe SI 500 represents the leading edge for inductive coupled plasma (ICP) processing. It is based on the ICP plasma source PTSA, dynamic temperature controlled substrate electrode, fully controlled vacuum system, advanced SENTECH control software using remote field bus technology, and a very user-friendly general user interface for operating the SI 500.\n<ul>\n<li data-sourcepos=\"11:1-11:456\">Flexibility and modularity are design characteristics of the SI 500 High etch rate; Low damage;<\/li>\n<li data-sourcepos=\"11:1-11:456\">High aspect ratio; superior homogeneity; User-friendly GUI operational software.<\/li>\n<li data-sourcepos=\"11:1-11:456\">Available etchants: Standard gas line and MFC with gases (SF6, Ar, O2, N2, C4F8, CHF3) films.<\/li>\n<\/ul>\n<strong>Technical Specifications<\/strong>\nSubstrate: 100 mm wafer size<br \/>\nChamber (AlMg) with Liner RF generator<br \/>\nAutomatic single wafer vacuum load-lock<br \/>\nRF generator (RIE) \/Substrate electrode: power 600 W; frequency 13.56 MHz<br \/>\nRF generator (ICP)\/Upper electrode: power 2500 W; frequency 13.56 MHz\n<p><b>Location: T-Lab, level 11, Litho-Lab<\/b><\/p>\n\t\t\t\t<img loading=\"lazy\" decoding=\"async\" src=\"https:\/\/cde.nus.edu.sg\/mse\/wp-content\/uploads\/sites\/4\/2024\/05\/plasma-etch-243x300-1.jpg\" alt=\"plasma-etch-243x300\" height=\"300\" width=\"243\" title=\"plasma-etch-243x300\" \/>\n\t<h3>Plasma Etch system: Diener Electronic &#8211; PICO 300<\/h3>\nCleaning of surfaces (e.g. before bonding, soldering or gluing)<br \/>\nActivation of surfaces (e.g. before printing, varnishing or gluing)<br \/>\nAvailable gases:\u00a0Ar, O2, N2\n<strong>Technical Specifications<\/strong>\nPower:\u00a0 0-300w<br \/>\nAr: 0-20sccm; O2: 0-50sccm\n<p><b>Location: T-Lab, level 11, Clean Room and Litho-Lab<\/b><\/p>\n\t\t\t\t<img loading=\"lazy\" decoding=\"async\" src=\"https:\/\/cde.nus.edu.sg\/mse\/wp-content\/uploads\/sites\/4\/2024\/05\/e-beam-device.jpg\" alt=\"e-beam-device\" height=\"861\" width=\"646\" title=\"e-beam-device\" \/>\n\t<h3>E-beam\/Thermal Evaporator: AJA international-ATC-ORION-8E U\u00a0<\/h3>\n<p>This UHV deposition system is capable of producing good quality thin films of metals, alloys and their multilayers. Able to handle 8&#8243; wafers size.<\/p>\n<p>Targets:<\/p>\n<ul>\n<li>E-beam: Ti, Cr, Al<\/li>\n<li>Thermal: Au, Cu<\/li>\n<\/ul>\n<strong>Technical Specifications<\/strong>\n<ul>\n<li>Load lock best vacuum: 10-7 torr<\/li>\n<li>Main chamber best vacuum: 10-9 torr<\/li>\n<li>Cylindrical chamber size:\u00a0 36\u2033 high x 24\u2033 diameter<\/li>\n<li>Substrate rotation during deposition<\/li>\n<li>Equipped with quartz thickness monitor<\/li>\n<li>Four thermal evaporation sources (molybdenum boats) and 5 E-beam crucible sources (graphite)<\/li>\n<\/ul>\n<p><b>Location: T-Lab, level 11, Litho-Lab<\/b><\/p>\n\n","protected":false},"excerpt":{"rendered":"<p>Devices Providing a wide range of support for various interdisciplinary research, the Litho Lab &amp; Cleanroom facilities are equipped for UV lithography, thin film coating, reactive ion etching etc.\u00a0 Thin Film Deposition Facilities The Litho Lab consists of a clean room fully equipped for UV lithography and other processes (e.g. thin film deposition, RIE\/ICP dry [&hellip;]<\/p>\n","protected":false},"author":285,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"site-sidebar-layout":"default","site-content-layout":"default","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-gradient":""}},"footnotes":""},"class_list":["post-16629","page","type-page","status-publish","hentry"],"acf":[],"_links":{"self":[{"href":"https:\/\/cde.nus.edu.sg\/mse\/wp-json\/wp\/v2\/pages\/16629","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/cde.nus.edu.sg\/mse\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/cde.nus.edu.sg\/mse\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/cde.nus.edu.sg\/mse\/wp-json\/wp\/v2\/users\/285"}],"replies":[{"embeddable":true,"href":"https:\/\/cde.nus.edu.sg\/mse\/wp-json\/wp\/v2\/comments?post=16629"}],"version-history":[{"count":10,"href":"https:\/\/cde.nus.edu.sg\/mse\/wp-json\/wp\/v2\/pages\/16629\/revisions"}],"predecessor-version":[{"id":17191,"href":"https:\/\/cde.nus.edu.sg\/mse\/wp-json\/wp\/v2\/pages\/16629\/revisions\/17191"}],"wp:attachment":[{"href":"https:\/\/cde.nus.edu.sg\/mse\/wp-json\/wp\/v2\/media?parent=16629"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}