Key Features

Liquid Cooling – Direct-to-Chip Hybrid Cooling & Immersion Cooling
Unibody hybrid cooled heat sink with optimized fin array design for leak-free direct chip liquid cooling
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Liquid-cooled server installed with Unibody Hybrid cooled heat sink
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High-density liquid-cooled servers for reduced server and cooling power consumption
Manifold wall for smart monitoring and control of operating parameters for better energy efficiency
Manifold wall for smart monitoring and control of operating parameters for better energy efficiency
Servers placed in Immersion cooling tank (Single-phase)
Servers placed in Immersion cooling tank (Single-phase)
Mid- to high-density servers to future proof cooling solutions_3
Mid- to high-density servers to future proof cooling solutions
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Hot Aisle containment
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Fan coil wall with multiple heat rejection options
StatePoint Liquid Cooling unit for providing cold water to the data hall through high-performing membrane-based indirect evaporative cooling
StatePoint Liquid Cooling unit for providing cold water to the data hall through high-performing membrane-based indirect evaporative cooling