Focused Ion Beam Microscopes

Ga+ Sample Preparation FIB

FEI Helios 450S Dual Beam

The FEI Helios 450S FIB is a dual beam Ga+ ion & electron microscope with high-resolution topographical imaging and patterning capabilities. The electron beam is primarily used for surface characterization, while the ion beam is used for top-down fabrication tasks such as TEM lamella preparation, cross-section failure analysis, and nanoscale surface modification. The stability of the low voltage ion beam and chamber cleaning attachments reduces contamination and amorphization vital for S/TEM analysis.

  • Field-emission electron gun
  • LMIS: Ga ion beam (0.2 – 30 kV) / Tomahawk ion column
  • Spatial Resolution: 0.9 nm (SEM), 4.5 nm (FIB)
  • ETD SE detector
  • STEM detector
  • Pt & C gas injection systems
  • OmniProbe manipulator
  • Plasma cleaner / cold trap

Location: E4-02-05

Lee Cheng Choo
cl.cheng@nus.edu.sg

Ga+ Large-chamber FIB

FEI Versa 3D Dual Beam

The Versa 3D DualBeam FEG FIB-SEM combines a focused Ga ion beam with a high-resolution field-emission electron gun. Owing to a large chamber allowing up to 6" industry wafers with full rotation, the Versa 3D provides enhanced 2D and 3D materials characterization and analysis for a wide range of material science and industry-related samples.

  • Field-emission electron gun
  • LMIS: Ga ion beam (0.5 – 30 kV) / Sidewinder ion column
  • Spatial Resolution: 1.2 nm (SEM)
  • ETD SE detector
  • Pt & C gas injection systems
  • EasyLift manipulator
  • 150 mm maximum sample size

Location: E4-02-05

Lee Cheng Choo
cl.cheng@nus.edu.sg

He+/Ne+ High-resolution FIB

Zeiss Orion NanoFab

The Orion NanoFab Helium Ion Microscope (HIM) operates using ionized Helium or Neon gases rather than electrons for imaging and milling of materials. With the significantly smaller interaction volume, alongside the smaller de Broglie wavelength, the HIM can achieve finer spatial resolution and larger depth-of-field compared to a FE-SEM. Nanomachining fabrication with sub-10 nm feature sizes is achievable through lighter He ions, while faster milling is operated through heavier Ne ions.

  • GFIS: He ion beam (10 – 30 kV), Ne ion beam (10 – 25 kV)
  • Spatial Resolution: 0.5 nm (He+), 1.9 nm (Ne+)
  • ETD SE detector
  • Electron flood gun
  • Chamber plasma cleaner
  • 80 mm loadlock

Location: E4-02-15

Ashley Xu
xyue20@u.nus.edu

Scanning Electron Microscopes

Field-emission SEM

Zeiss Sigma 300

The Zeiss Sigma 300 is a field-emission SEM able to perform high resolution imaging with secondary and backscattered electrons. It has the function to operate under high and low pressure conditions, allowing the imaging of specimens that are poorly conductive or specimens that cannot be imaged under vacuum.

  • Field-emission electron gun, GEMINI column
  • Spatial Resolution: 1 nm (15 kV)
  • Acceleration Voltage: 0.02–30 kV
  • Probe current: 3–20 nA
  • ETD SE, in-lens SE detector, retractable BSE detector
  • High/low vacuum
  • Oxford Ultim Max 65 mm2 EDX

Location: E3A-05-12

Shen Jingjing
shenjj2@nus.edu.sg

Field-emission SEM

Zeiss Supra 40

The Zeiss Supra 40 SEM has a Schottky field-emission source, providing excellent beam brightness and probe current stability suitable for quantitative analytical applications. It is equipped with an Oxford silicon drift EDS detector, allowing continuous live-view chemical imaging.

  • Field-emission electron gun, GEMINI column
  • Spatial Resolution: 1.5 nm (10 kV)
  • Acceleration Voltage: 0.1–30 kV
  • Probe current: Up to 20 nA
  • ETD SE, in-lens SE detector
  • Oxford Ultim Max 65 mm2 EDX

Location: E3A-05-12

Shen Jingjing
shenjj2@nus.edu.sg