Listen to the SIT & JUB Conference Talk by Nobel Prize Winner Professor Sir Konstantin Novoselov

SIT & JUB Insights in Technology Conference is a unique event that gathers the world’s top speakers in Machine Intelligence, Quantum Technologies, Advanced Materials, and Business Sciences.

Sir Konstantin Novoselov is known to be a pioneer in his field and, to date, has had an impressive career with numerous awards and recognitions. In 2010, he was awarded the Nobel Prize in Physics alongside Professor Andre Geim for their groundbreaking work and achievements with the two-dimensional material graphene.

Sir Konstantin Novoselov is currently a professor at the Centre for Advanced 2D Materials at the National University of Singapore.

Watch the Recording

Recent News

Fluid-like electrons unlock new tech possibilities

By Asst Prof Denis Bandurin Presidential Young Professor, Materials Science and Engineering In high school science class, we learned that plugging a cable into an electrical circuit sets off a flow of electrons, powering everything from our lights to our phones. Traditionally, we’ve understood how electrons behave in metals and semiconductors through a simple model:

CDE researchers honoured among region’s rising young scientists

Two researchers from CDE have been recognised in the 2024 edition of the MIT Technology Review Innovators Under 35 (TR35) Asia Pacific list for their accomplishments and contributions to the progress of science and technology. Assistant Professor Zhu Di and Adjunct Assistant Professor Ady Suwardi (both from Materials Science and Engineering) were among 35 people

NUS researchers develop a novel technique to fabricate three-dimensional circuits for advanced electronics

CHARM3D paves the way for the efficient printing of free-standing 3D structures that offer high electrical conductivity, self-healing capabilities and recyclability — a boon for electronics in healthcare, communications and security Unlike traditional printed circuit boards, which are flat, 3D circuitry enables components to be stacked and integrated vertically — dramatically reducing the footprint required