Deposition and Growth Cluster
| Tools | Available Resources and Targets |
|---|---|
|
ALD @ L5 Cleanroom |
Al2O3, HfO, ZrO and TiN |
|
E-Beam Evaporator – AJA UHV @ L1 CR |
Ti, Al, Ni, Ag, Au, Pt, Pd, Nb, In, TiN, SiO2, Al2O3 and Ta2O5 |
|
Sputter – AJA UHV @ L1 CR |
Ti, Mo, W, SiO2, Pt, ZnO, HfO, ITO, NiOx and IGZO |
|
Sputter – ULVAC Multi-chamber (Majest S200) |
Mg, Cu, W, Fe60Co20B20, Fe90Co10, Fe80B20, Co, Pt, Ru, Ta, Ti and MgO |
Etch Cluster
| Tools | Available Resources and Targets |
|---|---|
|
ICP Etch Cluster @ L5 Cleanroom |
Metal etch (W, Al, AlN tested)
|
|
|
InP grating etch |
|
PECVD @ L5 Cleanroom |
HfO, ZrO and TiN |
|
Sputter – ULVAC Multi-chamber (Majest S200) |
Mg, Cu, W, Fe60Co20B20, Fe90Co10, Fe80B20, Co, Pt, Ru, Ta, Ti and MgO |
Lithography Cluster
| Tools | Available Resources and Targets |
|---|---|
|
Laser Writer @ L1 Cleanroom |
Z1512 and AZ1518
|
|
Mask Aligner @ L1 CR |
UV and DUV; |
|
|
AZ1512 and AZ4110 |
Last Update: 27 June 2021