SCIA COAT 200 - ION BEAM DEPOSITION AND ETCHING

System Overview

The SCIA Coat 200 is designed for homogeneous coating of high precision optics such as X-ray mirrors and optical filters with the technology of Dual Ion Beam Deposition (DIBD). The system is also equipped with a RF350-e ion beam source for etching process.

 

Technical Specifications

SCIA Coat 200 Ion Beam Deposition and Etching

  • Cylindrical ICP ion beam source RF350-e
  • Beam diameter of 350 mm at extraction grid
  • Inductively coupled plasma (ICP) based plasma excitation with RF generator at 4.00 MHz
  • ion energy: < 100 eV; Max. ion energy: > 1500 eV
  • Ion current density up to 1 mA/cm² with flat grid system
  • Wafer chuck for 200 mm wafers
  • Substrate rotation up to 20 rpm, Substrate holder tilt between 0° – 170° in 0.1° steps
  • A standard 4-port handling robot for fully automatic handling of wafers
  • Load-lock for loading of three 200 mm wafers
  • HAL IMP 301/3F Ion Milling End Point Detection System
  • With Secondary Ion Mass Spectroscopy (SIMS), an in-situ measurement of
    sputtered material from substrate can be done.
  • The system is controlled by Windows 7 with fully SEMI-standard compatible
    software suite.
  • Etch rate: > 8 nm/min, uniformity: ≤ 8 % 3σ, reproducibility (10 runs) ≤ 3 % 3σ.
  • Deposition rate (Ta) > 6 nm/min, uniformity: ≤ 3 % 3σ , reproducibility (10 runs) ≤ 2 % 3σ

 

Location: E6-01-02, Class 100 Cleanroom

Contact: e6nanofab@nus.edu.sg