This system consists of Autoloader, Transfer Chamber, Pre-clean Chamber , RTP Chamber & Sputter chamber sections.

• • • Autoloader: Dual-arm ROBOT, Alignment station, 2 Stage cassette Interface, metal wafer stocker for 200mm wafer (25 pcs. of wafers capacity)
    • Transfer Chamber: Wafer transfer robot Keytran-IV (KRC-4000Z) Dual arm
    • Pre-clean Chamber: 2 gas Lines (Ar 100sccm, Ar 5 sccm), LT-ICP Electrode and Ceramic Shield.
      • ESC hot plate stage and RF Power supply
    • RTP Chamber: (Ar 2SLM, N2 100sccm, O2 5sccm, Ar 100sccm), Quartz Pin stage, Gold Image Furnace (9zone Lamp) 
    • Sputter Chambers: The system has four sputter chambers with wafer stage rotation. Each sputter chamber has a sputter down mechanism with a permanent magnet rotation magnetron cathode. The sputter chamber can form the continual membrane of maximum of 3 layer loads “triple gun cathode”.
      • • • • Sputter Chamber-1 (DC/RF Sputter): (Ar 100 sccm, Ar 5 sccm),
            • Sputter Chamber-2 (DC Sputter): (Ar 100 sccm, Ar 5 sccm),
            • Sputter Chamber-3 (DC Co-Sputter): (Ar 100 sccm, N2 50 sccm, Ar 5 sccm, Kr 100 sccm), ESC hot plate stage
            • Sputter Chamber-4 (DC/RF Sputter): (Ar 100 sccm, N2 100sccm, Ar 5 sccm),
            • Control System: This system is fully automatically controlled by ULVAC’s CyberCELL, and this software has a flexible design consisting of fore transfer modes: series, parallel, series/parallel and random access. Operation is performed only on a Cluster Tool Controller (CTC) that has operator—friendly-human-interface design
    • Chambers and Targets

               

Location: E6-01-02, Class 100 Cleanroom

Contact: e6nanofab@nus.edu.sg