System Overview

The mask aligner operates either in contact or in proximity mode and able to handle a wide range of substrate sizes
from small pieces up to 200mm wafers.
 

Available Resource

• UV and DUV, AZ1512 and AZ4110
• Masks are not provided

Technical Specifications

• Able to handle substrate size of 25 mm round up to 200 mm round and
  200 x 200 mm square
• Capable to handle mask size ranging from 2”x2” up to 9”x9”
• DC lamps HG 350 W/S, HG 500 W, HG-XE 500 W
• X, Y, THETA- alignment stage for motorized operation, resolution 0.1um
• Alignment gap programmable from 1 to 1,000 micron, resolution at 1 micron
• MO optics for Highest Uniformity, Diffraction reduction, Focus depth increase
• Substrate Conformal Imprinting Lithography (SCIL) / PDSM Imprinting Lithography
• Imprint lithography up to 150mm
• Wavelength: 350 to 1200 nm
• TSA alignment accuracy: <0.5μm
• BSA alignment accuracy:<1.0 um
• Infra-red (IR) Alignment, BSA alignment accuracy ≤ 1µm
• UV uniformity: +/-3.5% for 8” wafer
• Patterning of structures resolution below 0.8 μm
• Alignment accuracy down to 0.25 μm
• (SCIL) / PDSM Imprinting Lithography resolution better than 100nm

Location: E6-01-03, Cleanroom, Class 100

Contact: e6nanofab@nus.edu.sg