System Overview

Karl Suss MA6 is a manual mask aligner for contact or proximity UV lithography. It supports small, irregular sample pieces as well as standard 2-inch wafers, making it suitable for prototyping and teaching use in the L2 cleanroom.

Technical Specifications

• Exposure Optics: UV400 broadband; I-line (365 nm) and G-line (405–436 nm) 
• Lamp Power: ~350 W Hg lamp 
• Exposure Modes: Proximity, soft/hard contact, low-vacuum & vacuum contact, flood exposure 
• Top-Side Alignment (TSA) with X/Y/Θ micro-positioning; accuracy ~±0.5 µm 
• Manual X/Y/Θ micro-positioning with microscope viewing for small areas  
• Proximity Gap: Programmable ~10–300 µm (1 µm steps, tool-dependent)  
• Substrate Size: Irregular chips/dies up to 2″ wafers (< 4mm thick) 
• The max coupon size is 2cm square 
• Mask Size: Typically 3″ square chrome/glass masks (user-supplied)  
• Vacuum contact: ~0.4–0.6 µm 
• Soft-/hard-contact: ~0.5–1 µm  
• Proximity (~20 µm gap): ~2.5–3.5 µm

Location: E6-02-07, Level 2 Cleanroom, Class 10000

Contact: e6nanofab@nus.edu.sg