Technical specifications

• Placement accuracy: ±0.5 µm
• Field of view: 3.8 mm x 2.7 mm
• Field of view resolution: 1µm / pix
• Extended field of view: 83 mm x 2.7 mm
• Component size (min): 0.07 mm x 0.07 mm
• Component size (max): 100 mm x 100 mm
• Substrate support (max): 300 mm x 300 mm
• X-travel / resolution1: 2.5 mm / 1 µm
• Y-travel / resolution1: 2.5 mm / 1 µm
• Z-travel / resolution: 10 mm / 10 µm
• Theta travel: ±15° (±2° fine travel)
• Working area: 450 mm x 150 mm
• Bonding force range: 0.2 – 40 N / 1 – 500 N
• Heating temperature: 450 °C

Applications

• Reflow soldering
• Bonding
• Thermal processing

 Location: E6, Level 6, Dry Lab

Contact: e6nanofab@nus.edu.sg