ATOMIC LAYER DEPOSITION (ALD) BENEQ • Model TFS 200• Precursor: TDMAHf, TEMAZr, Ozone, H2O, TMA, SAM-24.• Films: Al2O3, HfO2, ZrO2, HZO and SiO2.• Up to 8” wafers size• High aspect ratio depositions up to 2000:1• Deposition uniformity: Al2O3 <=2%(12nm Al2O3 ,200nm Si-wafer with 5nm edge exclusion)Location: E6-05-09, CleanroomContact: e6nanofab@nus.edu.sg