CHEMICAL MECHANICAL PLANAZATION

System Overview

    • Metal and dielectric planarization (Cu Al, SiO2, SiN..)
    • Within wafer non-uniformity 5%
    • Run to run non-uniformity 5%
    • Finishing surface roughness 1nm

       

 

Location: E6-01-02, Class 100 Cleanroom

Contact:  e6nanofab@nus.edu.sg