System Overview

Hot plates are hotplates for soft bake and post exposure bake (PEB) used for baking photoresist which improves adhesion and dry etch resistance. Soft bake to drive off solvents and to solidify the photoresist film.

Technical Specifications

• Up to 200mm substrates
• Fast heating
• Temperature up to 250 degree C
• Small foot print
• Easy to operate.
• Harry Gestigkeit(Germany) Precision Hotplates, Model: PZ35

Location: E6-01-03, Class 10 Cleanroom

Contact:  Email: e6nanofab@nus.edu.sg