Infrared Reflow Oven - Invacu VSU35
Key Features
- Process Environment: Nitrogen, inert gas, formic acid, forming gas
- Maximum Temperature: 450°C
- Heating Area: 320 x 320 mm
- Heating Plate: Removable graphite
- Clearance Above Heating Plate: 60mm
- Heat Up / Cool Down Ramp Rate: 250°C/min
- Control Deviation: +/- 0.5°C
- Heating Elements: 8x infrared lamps (under graphite)
- Heating Control: Individual/adjustable
- Cooling of Heating Plate: Nitrogen flow
- Temperature Measurement: 2x thermocouples, K Type
- Pressure Measurement: Integrated pressure transmitter
- Maximum Vacuum: 1×10-2 mbar
- Cooling of Chamber Body: Water/Ethylene/Glycol
- Display: 10″ LCD with touch screen
- User Interface: Remote control over relay I/Os
Location: NUS SHINE Centre, E6, Level 6 Dry Lab
Contact: e6nanofab@nus.edu.s

