Invacu Infrared Vacuum Reflow Oven

 Key Features

  • Process Environment: Nitrogen, inert gas, formic acid,
    forming gas
  • Maximum Temperature: 450°C
  • Heating Area: 320 x 320 mm
  • Heating Plate: Removable graphite
  • Clearance Above Heating Plate: 60mm
  • Heat Up / Cool Down Ramp Rate: 250°C/min
  • Control Deviation: +/- 0.5°C
  • Heating Elements: 8x infrared lamps
    (under graphite)
  • Heating Control: Individual/adjustable
  • Cooling of Heating Plate: Nitrogen flow
  • Temperature Measurement: 2x
    thermocouples, K Type
  • Pressure Measurement: Integrated
    pressure transmitter
  • Maximum Vacuum: 1×10-2 mbar
  • Cooling of Chamber Body: Water/
    Ethylene/Glycol
  • Display: 10″ LCD with touch screen
  • User Interface: Remote control over relay I/Os

 Location: NUS SHINE Centre, E6, Level 6 Dry Lab

Contact: e6nanofab@nus.edu.s

  • Feature Item 1

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