Invacu Infrared Vacuum Reflow Oven
Key Features
- Process Environment: Nitrogen, inert gas, formic acid,
forming gas - Maximum Temperature: 450°C
- Heating Area: 320 x 320 mm
- Heating Plate: Removable graphite
- Clearance Above Heating Plate: 60mm
- Heat Up / Cool Down Ramp Rate: 250°C/min
- Control Deviation: +/- 0.5°C
- Heating Elements: 8x infrared lamps
(under graphite) - Heating Control: Individual/adjustable
- Cooling of Heating Plate: Nitrogen flow
- Temperature Measurement: 2x
thermocouples, K Type - Pressure Measurement: Integrated
pressure transmitter - Maximum Vacuum: 1×10-2 mbar
- Cooling of Chamber Body: Water/
Ethylene/Glycol - Display: 10″ LCD with touch screen
- User Interface: Remote control over relay I/Os
Location: NUS SHINE Centre, E6, Level 6 Dry Lab
Contact: e6nanofab@nus.edu.s
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Feature Item 1
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