Invacu Infrared Vacuum Reflow Oven Key FeaturesProcess Environment: Nitrogen, inert gas, formic acid,forming gasMaximum Temperature: 450°CHeating Area: 320 x 320 mmHeating Plate: Removable graphiteClearance Above Heating Plate: 60mmHeat Up / Cool Down Ramp Rate: 250°C/minControl Deviation: +/- 0.5°CHeating Elements: 8x infrared lamps (under graphite)Heating Control: Individual/adjustableCooling of Heating Plate: Nitrogen flowTemperature Measurement: 2x thermocouples, K TypePressure Measurement: Integrated pressure transmitterMaximum Vacuum: 1×10-2 mbarCooling of Chamber Body: Water/Ethylene/GlycolDisplay: 10″ LCD with touch screenUser Interface: Remote control over relay I/Os Location: NUS SHINE Centre, E6, Level 6 Dry LabContact: e6nanofab@nus.edu.s