MAGEST S200- MULTI CHAMBER SPUTTERING SYSTEM
Magest S200 is a batch-processing type multi-chamber sputtering system correspond to MRAM production.
Targets :
Mg, Cu, W, Fe60Co20B20, Fe90Co10, Fe80B20, Co, Pt, Ru, Ta, Ti, MgO
Processing Type :
Magnetic nanofabrication
System Overview
This system consists of Autoloader, Transfer Chamber, Pre-clean Chamber , RTP Chamber & Sputter chamber sections.
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- Autoloader: Dual-arm ROBOT, Alignment station, 2 Stage cassette Interface, metal wafer stocker for 200mm wafer (25 pcs. of wafers capacity)
- Transfer Chamber: Wafer transfer robot Keytran-IV (KRC-4000Z) Dual arm
- Pre-clean Chamber: 2 gas Lines (Ar 100sccm, Ar 5 sccm), LT-ICP Electrode and Ceramic Shield.
- ESC hot plate stage and RF Power supply
- RTP Chamber: (Ar 2SLM, N2 100sccm, O2 5sccm, Ar 100sccm), Quartz Pin stage, Gold Image Furnace (9zone Lamp)
- Sputter Chambers: The system has four sputter chambers with wafer stage rotation. Each sputter chamber has a sputter down mechanism with a permanent magnet rotation magnetron cathode. The sputter chamber can form the continual membrane of maximum of 3 layer loads “triple gun cathode”.
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- Sputter Chamber-1 (DC/RF Sputter): (Ar 100 sccm, Ar 5 sccm),
- Sputter Chamber-2 (DC Sputter): (Ar 100 sccm, Ar 5 sccm),
- Sputter Chamber-3 (DC Co-Sputter): (Ar 100 sccm, N2 50 sccm, Ar 5 sccm, Kr 100 sccm), ESC hot plate stage
- Sputter Chamber-4 (DC/RF Sputter): (Ar 100 sccm, N2 100sccm, Ar 5 sccm),
- Control System: This system is fully automatically controlled by ULVAC’s CyberCELL, and this software has a flexible design consisting of fore transfer modes: series, parallel, series/parallel and random access. Operation is performed only on a Cluster Tool Controller (CTC) that has operator—friendly-human-interface design
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- Chambers and Targets
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