MASK ALIGNER MA8 (CLASS 100)
System Overview
The mask aligner operates either in contact or in proximity mode and able to handle a wide range of substrate sizes
from small pieces up to 200mm wafers.
Available Resource
- UV and DUV, AZ1512 and AZ4110
- Masks are not provided
Technical Specifications
- Able to handle substrate size of 25 mm round up to 200 mm round and
200 x 200 mm square - Capable to handle mask size ranging from 2”x2” up to 9”x9”
- DC lamps HG 350 W/S, HG 500 W, HG-XE 500 W
- X, Y, THETA- alignment stage for motorized operation, resolution 0.1um
- Alignment gap programmable from 1 to 1,000 micron, resolution at 1 micron
- MO optics for Highest Uniformity, Diffraction reduction, Focus depth increase
- Substrate Conformal Imprinting Lithography (SCIL) / PDSM Imprinting Lithography
- Imprint lithography up to 150mm
- Wavelength: 350 to 1200 nm
- TSA alignment accuracy: <0.5μm
- BSA alignment accuracy:<1.0 um
- Infra-red (IR) Alignment, BSA alignment accuracy ≤ 1µm
- UV uniformity: +/-3.5% for 8” wafer
- Patterning of structures resolution below 0.8 μm
- Alignment accuracy down to 0.25 μm
- (SCIL) / PDSM Imprinting Lithography resolution better than 100nm
Location: E6-01-03, Cleanroom, Class 100
Contact: e6nanofab@nus.edu.sg