System Overview

The FINEPLACER sigma combines sub-micron placement accuracy with a 450 x 150 mm working area and bonding forces up to 500 N. The system is ideal for all types of precision die bonding and flip chip applications ready to be pushed toward wafer level. This includes complex 2.5D and 3D IC packages, Focal Plane Arrays (i.e. image sensors), MEMS/MOEMS, and more.

  Technical specifications

• Placement accuracy: ±0.5 µm
• Field of view: 3.8 mm x 2.7 mm
• Field of view resolution: 1µm / pix
• Extended field of view: 83 mm x 2.7 mm
• Component size (min): 0.07 mm x 0.07 mm
• Component size (max): 100 mm x 100 mm
• Substrate support (max): 300 mm x 300 mm
• X-travel / resolution1: 2.5 mm / 1 µm
• Y-travel / resolution1: 2.5 mm / 1 µm
• Z-travel / resolution: 10 mm / 10 µm
• Theta travel: ±15° (±2° fine travel)
• Working area: 450 mm x 150 mm
• Bonding force range: 0.2 – 40 N / 1 – 500 N
• Heating temperature: 450 °C

Location: E6-05, Class 10,000

Contact: e6nanofab@nus.edu.sg