System Overview

The NanoNex 2000 Imprint System delivers both thermal and UV nanoimprint lithography for advanced micro- and nanopatterning. Engineered for optimal performance on ceramic sol-gel surfaces, the system features built-in capabilities for extending master mold lifetime through intermediate polymer and ceramic sol-gel stamp replication processes. Additional technical specifications are outlined below.)

Technical Specifications

• Exposure Optics: UV400 broadband; I-line (365 nm) and G-line (405–436 nm) 
• Lamp Power: ~350 W Hg lamp 
• Exposure Modes: Proximity, soft/hard contact, low-vacuum & vacuum contact, flood exposure 
• Top-Side Alignment (TSA) with X/Y/Θ micro-positioning; accuracy ~±0.5 µm 
• Manual X/Y/Θ micro-positioning with microscope viewing for small areas  
• Proximity Gap: Programmable ~10–300 µm (1 µm steps, tool-dependent)  
• Substrate Size: Irregular chips/dies up to 2″ wafers (< 4mm thick) 
• The max coupon size is 2cm square 
• Mask Size: Typically 3″ square chrome/glass masks (user-supplied)  
• Vacuum contact: ~0.4–0.6 µm 
• Soft-/hard-contact: ~0.5–1 µm  
• Proximity (~20 µm gap): ~2.5–3.5 µm

Location: NanoNex 2000 | Level 2 | Cleanroom

Contact: e6nanofab@nus.edu.sg