ULTRA HIGH VACUUM E-BEAM EVAPORATION System Overview Able to handle up to 8” wafers sizeFor deposition metals, dielectrics, super-lattices, alloysCrystal deposition controller for co-depositionTargetsSiO2, Al, Ti, TiN, Ag, Ni. Users provide Pt, Pd, AuTechnical specifications Chamber size: 36″ high x 24″ ID10 kW High Voltage Power Supplies for e-beam source Dual-beam covering 4 crucibles for co-deposition and multi-layer depositionSubstrate rotation and 300W RF/DC biasing (incident ion energies of 50W to 300 eV)Location: E6-01-01, Class 1000 cleanroomContact: e6nanofab@nus.edu.sg