Key Features

• Process Area: 50mm (X) x 50mm (Y)   
• *Up to 100mm (X) x 100mm (Y)            (*with a different fixture)
• 3 points levelling tolerance: 0.5um.
• Feed rate: 40um/s – 20mm/s
• Closed-loop X/Y-axis positioning: 1um resolution. 
• Closed-loop Z-axis positioning: 0.1um resolution, 1um accuracy
• Closed-loop Z-axis force control: 0.5 – 10 N.User Interface: Easy to use with workflow guides.
• Software X-vision: Automatic 3D mapping/profiling (convex & concave

Process Mode & Material Removal

Position (Milling/Grinding) 

• FR-4
• Copper heat sink/lead frame
• Mold encapsulant
• Silicon
• Ceramic

Position Force (Grinding/Polishing)

• Passivation
• Remaining Mould compound
• Wire bonds
• Metal layers
• ILD/IMD

Floating Force (Polishing)

• Polishing cloth
• Diamond Paste (1,3,6,9, and 15um)
• Colloidal Silica (0.04um)

Applications

• Metallography
• Microelectronics
• Failure Analysis

 Location: E6, Level 2, Wet Lab

Contact: e6nanofab@nus.edu.sg