Open for Registration

Meet the Groundbreakers: Professor John Rogers, Northwestern University
Topic: Soft, Skin-Interfaced Devices for Health Monitoring and Haptic Interactions

This talk describes key emerging ideas in soft electronic, microfluidic and microelectromechanical systems for (1) continuous monitoring of vital signs in maternal, fetal and neonatal care, (2) biomarker analysis of sweat with athletes and cystic fibrosis patients and (3) vibro-haptic sensory feedback in rehabilitation.

Meet the Groundbreakers: Professor John Rogers, Northwestern University
Topic: Soft, Skin-Interfaced Devices for Health Monitoring and Haptic Interactions
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Connect@CDE Session II

Join us for a networking session with MOE Educators where you can learn more about the Engineering Scholars Programme and participate in discussion sessions with educators on key topics of interest. We will also bring you on a tour at CDE’s lab to learn more about the research activities and undergraduate programmes with hands-on activities.

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Connect@CDE Session I

Join us for a networking session with MOE Educators where you can learn more about the Engineering Scholars Programme and participate in discussion sessions with educators on key topics of interest. We will also bring you on a tour at CDE’s lab to learn more about the research activities and undergraduate programmes with hands-on activities.

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MOE Teacher Work Attachment Plus (TWA+) Programme

CDE is offering attachments opportunities from 17 of our undergraduate programmes. During the 2 weeks attachment, teachers will participate in a wide range of activities including hands-on laboratory learning, site visits, working with ongoing research teams, and observing lectures conducted by CDE professors. Gain first-hand insights into the undergraduate curriculum, teaching pedagogies and research activities

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E-HIVE

E-HIVE is held at the end of every semester where teams from Institute for Engineering Leadership (IEL)’s graduate modules get to pitch about new market opportunities and solutions of participating companies

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