Prof Douglas Yu serves as Chief Scientist of Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE). He is also a Professor in the Department of Electrical and Computer Engineering of NUS. Doug holds BSc (Physics)/MSc (Materials Science and Engineering, MSE) from National Tsing-Hua University, Taiwan, and PhD in MSE from Georgia Institute of Technology, USA.
Dr. Yu spent 30+ years in TSMC responsible for TSMC wafer process module pathfinding and development from 0.8 micron to 28nm, including Cu and Low-K interconnect technology. He then established TSMC advanced packaging and heterogeneous system integration technology from scratch. He initiated and developed TSMC 3DFabricTM, industry first system integration technology platform, including CoWoS®, InFO and SoICTM. 3DFabricTM plays enabling roles in advanced smart devices, IoT, and high-performance-compute (HPC) including cloud computing and AI/Machine Learning/Generative AI, changed semiconductor technology landscape since 2016. Furthermore, the addition of TSMC COUPETM invention to 3DFabricTM opens door for CPO (Co-Packaged-Optics), and more innovative nanoelectronics and photonics integrated system architectures for future advanced AI compute and communication applications.
Prior to TSMC, Doug developed sub-micron SoC devices and process technology at AT&T Bell Labs, USA. He received IEEE Rao Tummala Award, IEEE EPS Microelectronics Manufacturing Award, and President Science Prize (Taiwan). He is an IEEE Fellow, TSMC Distinguished Fellow, member of National Academy of Engineering (NAE, USA), and an Academician of Academia Sinica. He gave numerous invited/keynote/plenary speeches in international conferences, with 150+ papers and (co)authored 1,500+ granted US patents.
Disruptive 3DFabricTM revolutionized semiconductor technology, maintain Moore’s Law with SiP (System-in-Package) complementary to SoC (System-on-Chip), and empowers accelerated growth of semiconductor industry.